Name Kim Sungdong
Position professor
Tel +82-2-970-6353
E-mail sdkim@seoultech.ac.kr
Profile Download
Biography
B.A. Metallurgical Eng. Seoul National University, Korea, 1992
M.A. Metallurgical Eng. Seoul National University, Korea, 1994
Ph.D. Metallurgical Eng. Seoul National University, Korea, 1998
Careers
1. Post-doc, University of Twente, The Netherlands, 1999-2001
2. Research staff, Samsung Advanced Institute of Technology, 2001-2005
3. Professor, Seoul National University of Science and Technology, 2005-present
Selected Publications
* The most recent papers(SCI & SCIE only)
1. Younhwan Shin, Sarah Eunkyung Kim, Sungdong Kim, “Thermal Assessment of Copper Through Silicon Via in 3D IC” Microelectronic Engineering 156, 2-5 (2016)
2. Sungdong Kim, Youngju Nam, Sarah Eunkyung Kim, “Effects of forming gas plasma treatment on low temperature Cu-Cu direct bonding”, Japanese Journal of Applied Physics (in press)
3. Sarah Eunkyung Kim, Sungdong Kim, “Wafer level Cu-Cu direct bonding for 3D integration”, Microelectronic Engineering, 137, 158-163 (2015)
4. Sung-geun Kang, Youngrae Kim, Sarah Eunkyung Kim, and Sungdong Kim, “The Effects of Heat Treatment on Room Temperature Ferromagnetism in a Digitally Co Doped ZnO Thin Film” Electronic Materials Letters, 9(1) 7-11 (2013)
Journal Papers
- 수소 플라즈마 처리를 이용한 구리-구리 저온 본딩, 마이크로전자 및 패키징학회지, vol.28 No.4 pp.109~114, 2021
- Bonding Technologies for Chip to Textile Interconnection, 마이크로전자 및 패키징학회지, vol.27 No.4 pp.1~10, 2020
- Atomic layer deposited YSZ overlayer on Ru for direct methane utilization in solid oxide fuel cell, CERAMICS INTERNATIONAL, vol.46 No.2 pp.1705~1710, 2020
- Comparative Analysis of SnOx Thin Films Deposited by RF Reactive Sputtering with Different SnO/Sn Target Compositions, ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, vol.6 No.12 pp.765~771, 2017
- Transparent SnOx thin films fabricated by radio frequency reactive sputtering with a SnO/Sn composite target, THIN SOLID FILMS, vol.634 pp.175~180, 2017
- 액랭식 마이크로채널 시스템 내 냉매와 범프의 열 제거 효과에 대한 연구, 마이크로전자 및 패키징학회지, vol.24 No.2 pp.61~67, 2017
- SnO/Sn 혼합 타겟으로 스퍼터 증착된 SnO 박막의 열처리 효과, 마이크로전자 및 패키징학회지, vol.24 No.2 pp.43~48, 2017
- Effects of forming gas plasma treatment on low-temperature Cu-Cu direct bonding, Japanese Journal of Applied Physics, vol.55 , 2016
- 금속 범프와 마이크로 채널 액체 냉각 구조를 이용한 소자의 열 관리 연구, 마이크로전자 및 패키징학회지, vol.23 No.2 pp.73~79, 2016
- Experimental assessment of on-chip liquid cooling through microchannels with de-ionized water and diluted ethylene glycol, Japanese Journal of Applied Physics, vol.55 , 2016
- Thermal assessment of copper through silicon via in 3D IC, Microelectroic Engineering, vol.156 No.SPECIAL SI pp.2~5, 2016
- SnO/Sn 혼합 타겟을 이용한 SnO 박막 제조 및 특성, 한국재료학회지, vol.26 No.4 pp.222~227, 2016
- 마이크로 채널 디자인에 따른 온 칩 액체 냉각 연구, 마이크로전자 및 패키징학회지, vol.22 No.4 pp.31~36, 2015
- Study of Chip-level Liquid Cooling for High-heat-flux Devices, 마이크로전자 및 패키징학회지, vol.22 No.2 pp.27~31, 2015
- Thermal Management on 3D Stacked IC, 마이크로전자 및 패키징학회지, vol.22 No.2 pp.5~9, 2015
- Wafer level Cu-Cu direct bonding for 3D integration, Microelectronic Engineering, vol.137 pp.158~163, 2015
- Argon plasma treatment on Cu surface for Cu bonding in 3D integration and their characteristics, APPLIED SURFACE SCIENCE, vol.324 pp.168~173, 2015
- The Effects of Cu TSV on the Thermal Conduction in 3D Stacked IC, 마이크로전자 및 패키징학회지, vol.21 No.3 pp.63~66, 2014
- Characterization of flip chip bonded structure with Cu ABL power bumps, MICROELECTRONICS RELIABILITY, vol.54 No.8 pp.1598~1602, 2014
- Study of micro flip-chip process using ABL bumps, 마이크로전자 및 패키징학회지, vol.20 No.2 pp.37~41, 2014
- Effect of radio frequency power on the properties of p-type SnO deposited via sputtering, MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, vol.16 pp.1679~1683, 2013
- Development of Cu CMP process for Cu-to-Cu wafer stacking, J. Microelectron. Packag. Soc., vol.20 No.4 pp.81~85, 2013
- Full Duplex Robot System for Transferring Flat Panel Display Glass, 한국생산제조시스템학회지, vol.22 No.6 pp.996~1002, 2013
- Effects of Wafer Warpage on the Misalignment in Wafer Level Stacking Process, J. Microelectron. Packag. Soc., vol.20 No.3 pp.71~74, 2013
- TSV Liquid Cooling System for 3D Integrated Circuits, J. Microelectron. Packag. Soc., vol.20 No.3 pp.1~6, 2013
- Fabrication of Advanced Bump Layer for IC Power Delivery, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, vol.13 No.9 pp.6447~6450, 2013
- Cu/SiO2 CMP Process for Wafer Level Cu Bonding, J. Microelectron. Packag. Soc., vol.20 No.2 pp.47~51, 2013
- Wafer Level Bonding Technology for 3D Stacked IC, J. Microelectron. Packag. Soc., vol.20 No.1 pp.7~13, 2013
- The Effects of Heat Treatment on Room Temperature Ferromagnetism in a Digitally Co Doped ZnO Thin Film, Electronic Materials Letters, vol.9 No.1 pp.7~11, 2013
- Interconnect Process Technology for High Power Delivery and Distribution, Journal of the Microelectronics & Packaging Society, vol.19 No.3 pp.9~14, 2012
- Ti/Cu CMP process for wafer level 3D integration, Journal of the Microelectronics & Packaging Society, vol.19 No.3 pp.37~41, 2012
- Effect of RF power on SnO thin films obtained by sputtering, Journal of the Korean Ceramic Society, vol.49 No.5 pp.399~403, 2012
- Nitrogen doped p-type SnO thin films deposited via sputtering, MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL, vol.177 No.16 pp.1470~1475, 2012
- P- to n-Type Conductivity Inversion of Nitrogen-Incorporated SnO Deposited via Sputtering, ECS Solid State Letters, vol.1 No.2 pp.29~31, 2012
- Fabrication and Challenges of Cu-to-Cu Wafer Bonding, Journal of the Microelectronics & Packaging Society, vol.19 No.2 pp.29~33, 2012
- Wet Etching Characteristics of Cu Surface for Cu-Cu Pattern Direct Bonds, Journal of the Microelectronics & Packaging Society, vol.19 No.1 pp.39~45, 2012
- Redox reaction-assisted growth of ZnO nanowires on SnO2 thin films, Materials Letters, vol.66 No.1 pp.106~109, 2012
- Curve-typed PMMA Nanochannel Fabrication using Polymer Layer Transfer and Collapse Technique, Journal of the Korean Society for Precision Engineering, vol.29 No.1 pp.114~120, 2012
- Wafer warpage analysis of stacked wafers for 3D integration, MICROELECTRONIC ENGINEERING, vol.89 pp.46~49, 2012
- The Effect of Vacuum Annealing of Tin Oxide Thin Films Obtained by RF Sputtering, 한국세라믹학회지, vol.48 No.4 pp.316~322, 2011
- Nitrogen-doped transparent tin oxide thin films deposited by sputtering, CURRENT APPLIED PHYSICS, vol.11 No.4 pp.139~142, 2011
- Stress analysis of stacked Si wafer in 3D WLP, CURRENT APPLIED PHYSICS, vol.11 No.4 pp.119~123, 2011
- The Effects of UBM and SnAgCu Solder on Drop Impact Reliability of Wafer Level Package, 마이크전자 및 패키징학회지, vol.17 No.3 pp.65~69, 2010
- Characterization and Fabrication of Tin Oxide Thin Film by RF Reactive Sputtering, 한국재료학회지, vol.20 No.9 pp.494~499, 2010
- Effect of Bonding Process Conditions on the Interfacial Adhesion Energy of Al-Al Direct Bonds, 한국재료학회지, vol.20 No.6 pp.319~325, 2010
Conference Papers
- 추혁진, 김성동, 반도체 패키징 공정용 폴리머 절연층을 이용한 다층 재배선 구조 구현, 한국생산제조학회 2021년도 추계학술대회, 제주 KAL 호텔, 2021
- Injoo Kim, Sungdong Kim, Development of a Vacuum Device for Micro LED Transfer, The 19th International Symposium on Microelectronics and Packaging, Hanwha Resort, Busan, Korea, 2021
- HyeokJin Chu, Sungdong Kim, Implementation of Multi-RDL Layers Using Polymeric ILD for FOWLP, The 19th International Symposium on Microelectronics and Packaging, Hanwha Resort, Busan, Korea, 2021
- 추혁진, 김성동, CMP 대체를 위한 반도체 패키징 절연층 평탄화 기술 개발, 한국생산제조학회 2021년도 춘계학술대회, 강릉 세인트존스 호텔, 2021
- 문채인, 김성동, SMC를 이용한 FOPLP 몰딩 공정의 warpage 전산모사, 한국마이크로전자 및 패키징학회 2021 정기학술대회, AT센터 그랜드홀, 2021
- 김인주, 김성동, 진공 마이크로 채널을 이용한 micro-LED 전사 소자 개발, 한국마이크로전자 및 패키징학회 2021 정기학술대회, AT 센터 그랜드, 2021
- Hyeokjin Chu , Hyunjoo Kim, and Sungdong Kim, Mechanical Planarization of Polymer Dielectrics for FOWLP, 한국반도체학술대회, 온라인, 2021
- 김예빈, 김용화, 김성동, 조영학, 마이크로 LED 칩 전사용 진공 디바이스 개발, 대한기계학회2020년 학술대회, 온라인학술대회, 2020
- 추혁진, 김현주, 김성동, FOWLP 공정에서 CMP를 대체하는 평탄화 기술, 한국마이크로전자 및 패키징 학회 2020 정기학술대회, 한국과학기술회관, 2020
- 문채인, 노헌욱, 김성동, FOPLP 공정에서 다이 이동에 대한 전산모사, 마이크로전자 및 패키징 학회 2020 정기학술대회, 한국과학기술회관, 2020
- 김용화, 김예빈, 김인주, 김성동, Micro LED 패키지를 위한 대량전사 방법, 한국마이크로전자 및 패키징 학회 2020 정기학술대회, 한국과학기술회관, 2020
- 유하빈, 이상원, 추혁진, 김현주, 김성동, FOWLP에서 폴리이미드 절연층의 기계적 평탄화, 제27회 한국반도체학술대회, 하이원 그랜드호텔, 2020
- Heon-wook No, Chae-in Moon, Sungdong Kim, Panel Level Warpage Analysis with Various RDL Layouts, ISMP-EMAP 2019, Hotel Aqua Palace, Busan, 2019
- Donghoon Choi, Seungeun Han, and Sungdong Kim, Plasma Pre-treatment for Low-Temperature Cu-Cu Direct Bonding, ISMP-EMAP 2019, Hotel Aqua Paalce, Busan, 2019
- Min-gyu Kang, Heon-wook No, and Sungdong Kim, Comparison of Interconnection Methods for E-textile Applications, ISMP-EMAP 2019, Hotel Aqua Palace, Busan, 2019
- Habin Yoo, Sangwon Lee, and Sungdong Kim, Planarization of polymeric dielectrics for FOWLP, ISMP-EMAP 2019, Hotel Aqua Palace, Busan, 2019
- Habin Yoo, Sangwon Lee, Sungdong Kim, Novel thermal measurement of wafer warpage, The 34th International Technical Conference on Circuits/Systems, Computers and Communications, Jeju Shinhwa World, 2019
- 문아영, 김성동, PLP 제조 공정에 따른 warpage 해석, 제26회 한국반도체학술대회, 웰리힐리파크, 2019
- 강수정, 김예진, 이상원, 유하빈, 최동훈, 한승은, 김성동, FOWLP에서 폴리머 절연층의 평탄화 특성, the 26th Korean Conference on Semiconductors, 웰리힐리파크, 2019
- 조승범, 김성동, 김사라은경, Influence of different Si substrate thickness on electrical properties of p-channel SnP TFT, 한국재료학회 2017 추계학술대회, 경주, 2017
- 송창민, 김성동, 김사라은경, Process Assessment of Spin-On-Glass in Wafer Level Packaging Interconnect, 한국재료학회 2017 추계학술대회, 경주, 2017
- J. Pyun, S. Han, S. E. Kim and S. Kim, Planarization Characteristics of Polymeric Interlayer Dielectrics for FOWLP applicationas, the 6th International Symposium on Microelectronics and Packaging, COEX, 2017
- J. Lee and S. Kim, Warpage Simulation for 500x400 mm2 Panel Level Packaging, the 6th International Symposium on Microelectronics and Packaging, COEX, 2017
- S. B. Cho, C. Kim, S. Kim and S. E. Kim, Effect of Si substrate thickness on electrical properties of p-channel SnO TFT, the 6th International Symposium on Microelectronics and Packaging, COEX, 2017
- C. Song, S. Kim, and S. E. Kim, Evaluation of spin-dielectric for use in wafer level packaging interconnect, the 6th International Symposium on Microelectronics and Packaging, COEX, 2017
- Y. Won, S. Kim, S. E. Kim, Study of active thermal management method for IC devices, 2017 한국마이크로전자 및 패키징 학회 춘계학술대회, 세종대학교, 2017
- Sungdong Kim, Application of forming gas plasma to low-temperature Cu-Cu bonding for 3D IC, Interanational Conference on Electronic Materials and Nanotechnology for Green Environment, 제주 라마다 플라자 호텔, 2016
- Y. Nam, S. E. Kim and S. Kim, Hydrogen plasma treatment of Cu oxide for Cu-Cu direct bonding application, the 5th International Symposium on Microelectronics and Packaging, COEX, 2016
- S. H. Kim, I. Song, S. Shin, S. Kim, M. Park, I. Cho and S. Kim, Fabrication of the suspended high Q spirial inductor on 8 inch wafers, the 5th International Symposium on Microelectronics and Packaging, COEX, 2016
- Y. Won, S. Kim and S. E. Kim, Single-phase liquid cooling of silicon chips for high density microelectronics, the 5th International Symposium on Microelectronics and Packaging, COEX, 2016
- 김철, 김성동, 김사라은경, Effects of SnO/Sn composite target on rf reactive sputtered p-type SnO thin films, 2016년도 한국재료학회 춘계학술대회, 여수, 2016
- 원용현, 오경환, 김성동, 김사라은경, Effects of micro-channel liquid cooling with Cu or Ag bumps for IC thermal management, 2016 한국재료학회 춘계학술대회, 여수, 2016
- Sungdong Kim, Plasma assisted low temperature Cu-Cu bonding for 3D IC, 2016 International Conference on Electronics Packaging (ICEP), Sapporo, 2016
- 원용현, 김성동, 김사라은경, Characteristics of Micro-channel Liquid Cooling system with Various Metal Heat Spreaders and Coolants, 제23회 한국반도체학술대회, 강원도, 2016
- 김철, 김성동, 김사라은경, Characterization of P-type SnO Thin Films with SnO/Sn Composite Target for Transparent Device Applications, 제23회 한국반도체학술대회, 강원도, 2016
- Yunhwan Shin, Sarah Eunkyung Kim and Sungdong Kim, Thermal Influence of Through Silicon Via in 3D IC packaging, the 14th International Symposium on Microelectronics and Packaging, KINTEX, 2015
- Yonghyun Won, Manseok Park, Sungdong Kim, Sarah Eunkyung Kim, Fabrication of on-chip liquid cooling system for 3D IC thermal management, The 14th International Symposium on Microelectronics and Packaging, KINTEX, 2015
- Cheol Kim, Sungdong Kim, Sarah Eunkyung Kim, Tin Oxide deposited via RF sputtering with SnO/Sn composite target, The 14th International Symposium on Microelectronics and Packaging, KINTEX, 2015
- Youngju Nam, Sarah Eunkyung Kim and Sungdong Kim, H2/Ar plasma treatment of Cu for low temperature Cu-Cu direct bonding, The 14th International Symposium on Microelectronics and Packaging, KINTEX, 2015
- Younhwan Shin, Sarah Eunkyung Kim, Sungdong Kim, Experiment and thermal simulation of Cu through silicon via in 3D IC, Advanced Metallization Conference 2015, 서울, 2015
- Youngju Nam, Sarah Eunkyung Kim, Sungdong Kim, Effecs of forming gas plasma treatment on low temperature Cu-Cu direct bonding, Advanced Metallization Conference 2015, 서울, 2015
- Yonghyun Won, Manseok Park, Sungdong Kim, Sarah Eunkyung Kim, On-chip liquid cooling solution for high power IC devices, Advanced Metallization Conference 2015, 서울, 2015
- Manseok Park, Sungdong Kim, Sarah Eunkyung Kim, Experimental Characterization of TSV liquid cooling for 3D integration, 2015 IITC/MAM Conference, Grenoble, 2015
- Yoonhwan Shin, Sarah Eunkyung Kim, Sungdong Kim, Analysis of Thermal Effects of Through Silicon Via in 3D IC using Infrared Microscopy, 2015 IITC/MAM Conference, Grenoble, 2015
- Y. Shin, J. Ma, S. Kim, S. E. Kim, 3D IC Thermal Management using Cu Filled TSV, the 22nd Korean Conference on Semiconductor (KCS 2015), 송도컨벤시아, 2015
- M. Park, S. Baek, S. Kim, S. E. Kim, Liquid Cooling System with TSV for High Power 3D Packages, the 22nd Korean Conference on Semiconductor (KCS 2015), 송도컨벤시아, 2015
- 김철, 김성동, 김사라은경, Reliability evaluation of p-type SnO thin film deposited on Si substrate of various thickness, 한국 마이크로전자 및 패키징 학회 추계학술대회 초록집, 서울, 2014
- 백수정, 박만석, 김성동, 김사라은경, Experimental study of liquid cooling system with TSV and micro-channel, 한국 마이크로전자 및 패키징 학회 추계학술대회 초록집, 서울, 2014
- 김수형, 김사라은경, 김성동, High volume manufacturing challenges and opportunities for wafer level vertical interconnection, 한국 마이크로전자 및 패키징 학회 추계학술대회 초록집, 서울, 2014
- 신윤환, 마준성, 김사라은경, 김성동, Thermal management study for hot spot cooling in 3D IC, 한국 마이크로전자 및 패키징 학회 추계학술대회 초록집, 서울, 2014
- Manseok Park, Junsung Ma, Soojung Baek, Sungdong Kim, Sarah Eunkyung Kim, Development of TSV liquid cooling structure for 3D integration, IUMRS-ICA2015, Fukuoka, 2014
- Soohyung Kim, Younhwan Shin, Jieun Lee, Sarah Eunkyung Kim, Sungdong Kim, Wafer level Cu-Cu direct bonding with TSV for 3D Integration, IUMRS-ICA2014, Fukuoka, 2014
- Manseok Park, Soojung Baek, Sungdong Kim, Sarah Eunkyung Kim, Surface plasma treatment of Cu interconnect for Cu bonding in 3D integration and their characteristics, IUMRS-ICA2014, Fukuoka, 2014
- S. E. Kim, S. Kim, Wafer Level Cu-Cu Direct Bonding for 3D Integration, Materials for Advanced Metallization (MAM) 2014, Chemitz, 2014
- 마준성, 신소원, 김성동, 김사라은경, Feasibility of micro ABL bumps with flip chip process for high power devices and 3D interconnection, 한국마이크로전자 및 패키징학회 정기 학술대회 초록집, 서울, 2013
- 김수형, 송인협, 신소원, 박만석, 이민재, 김사라은경, 김성동, Alignment issue in wafer stacking process for 3D IC, 한국마이크로전자 및 패키징학회 정기 학술대회 초록집, 서울, 2013
- 이민재, 김선영, 김수형, 송인협, 신소원, 박만석, 김사라은경, 김성동, Assessment of wafer level Cu-Cu bonding process, 한국마이크로전자 및 패키징학회 정기 학술대회 초록집, 서울, 2013
- Sowon Shin, Soohyung Kim, Sarah Eunkyung Kim, Sungdong Kim, Evaluation of Wafer Warpage in 3D Stacking Technology, 15th International Conference on Electronic Materials and Packaging, KINTEX, 2013
- Inhyeop Song, Minjae Lee, Sungdong Kim, Sarah Eunkyung Kim, Development of Cu CMP Process for Cu-to-Cu Wafer Stacking, 15th International Conference on Electronic Materials and Packaging, KINTEX, 2013
- M. Park, S. Kim, J. Ma, S. Shin, I. Song, M. Lee, Sungdong Kim, S. E. Kim, Characterization and Fabrication of Wafer-level 3D Stacking, 15th International Conference on Electronic Materials and Packaging, KINEX, 2013
- 김선영, 임나은, 김수형, 김사라은경, 김성동, Fabrication and Reliability for 3D Stacked IC Manufacturing, 한국마이크로전자 및 패키징학회 2012 정기학술대회, 서울, 2012
- 이민재, 김성동, 김사라은경, Analysis of Cu CMP Effects in 3D Stacked IC Technologies, 한국마이크로전자 및 패키징학회 2012 정기학술대회, 서울, 2012
- 오경환, 마준성, 김성동, 김사라은경, Study of Advanced Bump Layer for Power Delivery Improvements, 한국마이크로전자 및 패키징학회 2012 정기학술대회, 서울, 2012
- Woonghee Youn, Sung-geun Kang, Sarah Eunkyung Kim and Sungdong Kim, The Room Temperature Ferromagnetism of Digitally Co Doped ZnO, IUMRS-ICA 2012, Busan, 2012
- Eunsol Kim, Minjae Lee, Sarah Eunkyung Kim, and Sungdong Kim, Cu CMP Evaluation for 3D Wafer Stacking, IUMRS-ICA 2012, Busan, 2012
- Naeun Lim, Sunyoung Kim, Soohyung Kim, Sarah Eunkyung Kim, Sungdong Kim, 3D Wafer Integration using TSV and Cu Bonding, IUMRS-ICA 2012, Busan, 2012
- Keong-Hwan Oh, Jinho Bae, Sungdong Kim, and Sarah Eunkyung Kim, Advanced Bump Layer(ABL) Process for IC Power Delivery, IUMRS-ICA 2012, Busan, 2012
- Joseph Um, Byeong-Min Roh, Sungdong Kim, Sarah Eunkyung Kim, P-Channel Thin-Film Transistor using Tin Oxide Deposited via Sputtering, IUMRS-ICA 2012, Busan, 2012
- S. Kim, Y. Cho, S. Kim, S. Kim, J. Lee, D. Chun and W. Jeung, The Influence of Substrate Bias on the Texture Control and Performance of Cr-V Underlayer for L10 FePt Thin Films, INTERMAG 2012, Vancouver, 2012
- 김성동, 마이크로시스템 패키징 기술개발, 2012 한국생산제조시스템학회 춘계학술대회, 제주KAL호텔, 2012
- Fabrication and characterization of wafer level Cu bonding, 한국마이크로전자 및 패키징학회 2011년 추계학술발표회, 2011
- CMP process for Ti/Cu interconnect, 한국마이크로전자 및 패키징학회 2011년 추계학술발표회, 2011
- 마이크로시스템 패키징 기술 개발, 대한기계학회 초록집, 2011
- Effect of nitrogen doped SnO thin films deposited by reactive sputting, ENGE2011, 2011
- Characterization of Cu CMP for Cu interconnect with Ti barrier, ENGE2011, 2011
- Cu-Cu Thermo-compression Bonding for wafer-to-wafer stacking, ENGE2011, 2011
- The effects of heat treatment on room temperature ferromagnet, ENGE2011, 2011
- 3D 패키지를 위한 웨이퍼 레벨 Cu-Cu 본딩 기술, 한국생산제조시스템학회 초록집, 2011
- Comparative study between N2-doped tin oxide by sputtering of, IUMRS-ICA 2011, 2011
- Fabrication and reliability of wafer level Cu-to-Cu bonding for 3D Integration, IUMRS-ICA 2011, 2011
- Analysis of Electromigration for Cu Pillar Bump in Flip Chip, EPTC, 2010
- Ferromagnetism in Co-doped ZnO with Multilayer Structure, ICAUMS, 2010
- Process Optimization of Cu-Cu Direct Bonding for TSV Applicat, ENGE, 2010
- Nitrogen-doped transparent tin oxide thin films deposited by, ENGE, 2010
- Stress analysis of stacked Si wafer in 3D-WLP, ENGE, 2010
- 웨이퍼 레벨 Cu-Cu 저온 접합 공정 평가 및 접합 계면 분석, 한국재료학회초록집, 2010
- SU-8 포토레지스트를 이용한 Bimorph Thermal Microactuator의 제, 한국정밀공학회 추계학술대회논문집, 2010
- KOH 이방성에칭을 이용한 나노채널 및 나노와이어 제작, 한국정밀공학회 추계학술대회논문집, 2010
- Evaluation of wafer warpage in 3D wafer stacking, IUMRS, 2010
Patents
- 플립 칩 패키지, 특허 등록, 대한민국, 2013
Projects
- 미래사회·산업수요에 대응하기 위한 대학혁신 정책연구, 산학협력단, 2019.09.~2020.02.
- ANSYS를 활용한 PKG 기판의 기계적 거동 해석, 대덕전자 주식회사, 2019.03.~2020.02.
- 수소 플라즈마 처리를 이용한 구리-구리 저온 본딩, 산학협력단, 2019.03.~2020.02.
- 칩-섬유 본딩 기술 개발, 한국기계연구원, 2019.01.~2019.12.
- 대면적 600mm 패널레벨 이종 복합 패키징 공정 및 Encapsulation 시스템 개발, 한국산업기술평가관리원, 2016.10.~2020.11.
- 고성능 FOWLP용 구리 재배선 및 봉지재 공정 기술 개발, 한국산업기술평가관리원, 2016.10.~2021.09.
- Fluxgate 센서용 코일제조기술 개발, 일진머티리얼즈(주), 2016.10.~2017.04.
- ICT 융합용 3차원 적층반도체의 1um 급 미세 수직배선 정렬 평가기술 및 적층 신뢰성 평가 개발기술 개발, 한국산업기술평가관리원, 2016.10.~2019.05.
- 반도체 장비/공정/소자 분야 맞춤형 교육 프로그램 개발, 에스케이하이닉스 주식회사, 2015.09.~2015.12.
- 2014년도 대학 산학협동교육 지원사업(I-ACE), (재)산학협동재단, 2014.03.~2015.02.
- 대학교육 특성화 사업 대응 정책연구, 산학협력단, 2014.01.~2014.02.
- Co 도핑된 ZnO 박막의 홀 효과에 대한 연구, 산학협력단, 2013.09.~2014.06.
- 웨이퍼 도금장비 기술 개발, (주)티케이씨, 2013.07.~2014.06.
- 3차원 적층 반도체에서의 열특성 관리에 대한 연구, 한국연구재단, 2013.06.~2015.05.
- [2차년도 LINC사업] 휴먼케어 센서용 이종소자집적 도금공정 기술 개발, 서울과학기술대학교 산학협력단, 2013.06.~2014.02.
- 현장중심형 캡스톤디자인 특성화 프로그램(기계시스템), 산학협력단, 2013.04.~2014.02.
- 3D IC 공정 중 웨이퍼 휨 발생에 대한 연구, 산학협력단, 2013.03.~2014.06.
- 2013년도 대학 산학협동교육 지원사업(I-ACE), (재)산학협동재단, 2013.03.~2014.02.
- 3D WLP 기술개발, 산학협력단, 2012.05.~2012.11.
- Co 도핑한 ZnO 자성반도체의 상온강자성 특성에 대한 연구, 산학협력단, 2012.05.~2013.03.
- 3D 패키징을 위한 Cu-to-Cu 웨이퍼 본딩 공정 최적화 연구, 산학협력단, 2012.05.~2013.06.
- 현장중심형 캡스톤디자인 프로그램, 기획처, 2012.05.~2013.02.
- 2단계 공학교육혁신센터지원사업, 한국산업기술진흥원, 2012.03.~2013.02.
- 2012년도 대학 산학협동교육 지원사업(I-ACE), (재)산학협동재단, 2012.03.~2013.02.
수상
- 2021학년도 교육분야 우수교육상, 2021학년도 교육분야 우수교원, 서울과학기술대학교, 2022
- Implementation of Multi-RDL Layers Using Polymeric ILD for FOWLP, Best Paper Awards, International Symposium on Microelectronics and Packaging, 2021
- SMC를 이용한 FOPLP 몰딩 공정의 warpage 전산모사, 우수 포스터 발표 논문상, 한국마이크로전자 및 패키징 학회, 2021
- Micro LED 패키지를 위한 대량전사 방법, 우수 포스터 발표 논문상, 한국마이크로전자 및 패키징 학회, 2020
- Planarization of Polymeric Dielectrics for FOWLP, Best Paper Award, ISMP-EMAP, 2019
- 2018학년도 교육분야 우수교육상, 2018학년도 교육분야 우수교육상, 서울과학기술대학교, 2019
- Planarization Characteristics of Polymeric Interlayer Dielectrics for FOWLP Applications, Best Poster Award, the Korean Microelectronics and Packaging Society, 2017
- Effects of micro-channel liquid cooling with Cu or Ag bumps for IC thermal management, 우수발표논문상, 한국재료학회, 2016
- Liquid Cooling System with TSV for High Power 3D Packages, Best Poster Award, 한국 반도체 학술대회, 2015
- Assessment of wafer level Cu-Cu bonding process, 우수 포스터 발표 논문상, 한국 마이크로전자 및 패키징 학회, 2013
- Fabrication and Reliability for 3D Stacked IC Manufacturing, 한국 마이크로전자 및 패키징 학회 2012년도 정기 학술대회 우수 포스터 발표 논문상, 한국 마이크로전자 및 패키징 학회, 2012
- Outstanding Poster Award (IUMRS-ICA 2011, 12th International Conference in Asia), IUMRS-ICA 2011, 2011